India Targets 3 Nanometer Chip Manufacturing by 2032
Union Minister Ashwini Vaishnaw announced on 27 January that the Government of India aims to manufacture 3 nanometer node advanced semiconductor chips by 2032. These high-end chips are widely used in modern products such as smartphones, computers, and other advanced electronic devices.
The minister stated that under the second phase of the Design-Linked Incentive (DLI) Scheme, the government will focus on six categories of chips: Compute, Radio Frequency (RF), Networking, Power, Sensors, and Memory. This approach will allow Indian companies to maintain major control over 70–75% of technology product development in the country.
“Our target for 2032 is to reach both the design and manufacturing of 3 nanometer chips. We are already capable of chip design today, but manufacturing must catch up to the 3 nm level,” Vaishnaw said after a meeting with 24 chip design firms selected under the DLI scheme.
The government now plans to scale the program further, with the next phase aiming to enable at least 50 fabless semiconductor companies in India. The DLI scheme is designed to accelerate domestic chip design capabilities by supporting startups and companies in areas such as System-on-Chip (SoC), telecommunications, power management, artificial intelligence (AI), and Internet of Things (IoT).
Vaishnaw highlighted that companies under the DLI scheme have attracted nearly ₹430 crore in venture capital funding, reflecting growing confidence in India’s semiconductor design ecosystem.
The minister emphasized that focusing on the six core chip systems would help build a broad and resilient semiconductor ecosystem. By 2029, India is expected to have substantial manufacturing and design capacity for chips required in 70–75% of domestic applications.
He noted that every sector requires different combinations of these six chip types, making their development critical for technological independence.
On infrastructure development, Vaishnaw said the government is investing ₹4,500 crore to modernize the Semiconductor Laboratory in Mohali, which will support tape-outs in the 180 nanometer range. Meanwhile, the upcoming manufacturing facility in Dholera will enable advanced nodes up to 28 nanometers.
Speaking on talent development, the minister said that against a 10-year target of 85,000 skilled professionals, more than 67,000 semiconductor professionals have already been trained in just four years, indicating rapid progress in workforce readiness.